Connector having a built-in electronic part

ABSTRACT

In a connector with a component built-in, a base member is formed of three-dimensional formation circuit substrate, and has a fitting portion that is to be fitted to a connector of counterpart. Terminals electrically connected to a wiring pattern on a mother board, contacts electrically connected to contacts of the connector of counterpart, and a conductive pattern electrically connected to the electronic component are formed on a surface of the base member. Thus, the conductive pattern can easily be modified depending on application, and it is possible to provide complicated wirings. Furthermore, since the electronic component is mounted on the base member, it is possible to make the connector embed a lot of electronic components, and degrees of freedom of design are increased. Still furthermore, the electronic component can be connected by reflow soldering, so that mounting workability of the electronic component is increased.

TECHNICAL FIELD

The present invention relates to a connector with an electroniccomponent built-in.

BACKGROUND ART

In a mid flow of electric wiring to electronic equipments, electroniccomponents such as a capacitor, a resistor, a diode are used for purposein total. As a method to simplify the electric wiring, the connectorwhich has an electronic component built-in is suggested conventionally.

FIG. 9A shows a configuration of a conventional connector with anelectric component built-in, which is, for example shown in JapaneseLaid-Open Patent Publication No. 2002-198132. In this conventionalconnector, a capacitor 101 is used as an electronic component, and twolead terminals 104 a and 104 b of the capacitor 101 are respectivelysoldered to a conductor 102 of a cable and an inner conductor terminal103 of a connector, so that the conductor 102 and the inner conductorterminal 103 are electrically connected via the capacitor 101. Thecapacitor 101, conductor 102 and the inner conductor terminal 103 areinsulated by an insulating material 105 and an outside conductorterminal 106.

In addition, FIG. 9B shows a configuration of another conventionalconnector with an electronic component built-in, for example, shown inJapanese Laid-Open Patent Publication No. 2002-184532. In this anotherconventional connector, electrodes 112 a and 112 b provided on both endsof a chip type electronic component 111 are respectively soldered to arear end portion 113 a of a fitting terminal. 113 and a rear end portion114 a of a connecting terminal 114, so that the integrated chip typeelectronic component 111, the fitting terminal 113 and the connectingterminal 114 are fixed on a connector housing 115.

As mentioned above, it is difficult to perform a mounting operation ofthe electronic component in an inside of the connector by theconventional method for soldering the electronic component to the metalterminals or a conductor such as the cable. Therefore, modifications ofthe circuit structure and the conductive pattern cannot be performedeasily, so that it is difficult to correspond to purpose alteration. Inaddition, it is difficult to put complicated electric wiring for aconnector interior, and it is difficult to let connector have a lot ofelectronic components built-in. Furthermore, since a plurality ofmembers is necessary for protecting the electronic component, a mountingoperation of the component is complicated.

DISCLOSURE OF INVENTION

The present invention is made to solve the problems of theabove-mentioned prior arts, and the object of the invention is toprovide a connector which can make a modification of a conductivepattern of a connector easily, and can realize the increase of degreesof freedom of design of electric wiring and enhancement of mountingworkability of an electronic component.

For achieving the above-mentioned object, a connector with an electroniccomponent built-in in accordance with an aspect of the present inventioncomprises: a base member formed of a three-dimensional formation circuitboard; terminals formed on said base member and electrically connectedto wiring pattern of a mother board; a fitting portion formed on saidbase member, and to be fitted to a counterpart connector; contactsarranged on said fitting portion and to be electrically connected withcontacting terminal portions of said counterpart connector; an electriccomponent disposed on said base member; and a conductive pattern formedon said base member for electrically connecting said terminals or saidcontacts with said electronic component.

According to such a configuration, since the conductive pattern, theterminals and the contacts are formed on the base member of thethree-dimensional formation circuit board, it is relatively easy tomodify the conductive pattern depending on application. Furthermore,since the superficial area of the base member of the three-dimensionalformation circuit board is relatively larger, it is possible to form acomplicated electric wiring, so that it is possible to built-in a lot ofelectronic components in the connector. As a result, degrees of freedomof design of electric wiring can be increased. Still furthermore, sincethe electronic component is disposed on the base member of thethree-dimensional formation circuit board, it is possible to connect theelectronic component by reflow soldering, so that the mountingworkability of the electronic component is increased.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a sectional view showing a configuration of a connector withan electronic component built-in in accordance with a first embodimentof the present invention.

FIG. 2 is a perspective view showing a configuration of a header of theconnector in accordance with the first embodiment.

FIG. 3 is a flowchart showing manufacturing processes of a base memberof the connector (or the header) by electrolytic plating in accordancewith the first embodiment.

FIG. 4 is a sectional view showing a configuration of a base member justbefore implementation by above manufacturing process.

FIG. 5 is a sectional view showing a configuration of a modification ofthe connector in accordance with the first embodiment.

FIG. 6 is a sectional view showing a configuration of a connector withan electronic component built-in in accordance with a second embodimentof the present invention.

FIG. 7 is a sectional view showing a configuration of a modification ofthe connector in accordance with the second embodiment.

FIG. 8 is a sectional view showing a configuration of a connector withan electronic component built-in in accordance with a third embodimentof the present invention.

FIG. 9A is a sectional view showing a configuration of a conventionalconnector with an electronic component built-in, and

FIG. 9B is a perspective view showing a configuration of anotherconventional connector with an electronic component built-in.

BEST MODE FOR CARRYING OUT THE INVENTION

A connector with an electronic component built-in in accordance with afirst embodiment of the present invention is described in detail withreference to drawing. FIG. 1 is a sectional view showing a configurationof the connector in accordance with the first embodiment. As shown inFIG. 1, the connector in accordance with the first embodiment iscomprised of a header 1 and a socket 6, and an electronic component 4 isbuilt-in to the header 1. In addition, FIG. 2 is a perspective viewshowing a configuration of the header 1.

As can be seen from FIG. 1 and FIG. 2, the header 1 comprises a basemember 2 of a three-dimensional formation circuit board which is formedof, for example, thermosetting resin, ceramics, or the like, aconductive pattern 3 formed on the base member 2, an electroniccomponent 4 mounted on the base member 2, and so on.

The base member 2 has a rectangular plane portion 5 and a fittingportion 29 formed on a center of the plane portion 5. The fittingportion 29 has a substantially rectangular parallelepiped shape, and itis to be fitted to a concavity 61 formed to the socket 6 which is acounterpart. In the center of the fitting portion 29, a concavity 9 ofrectangular parallelepiped shape having a depth measure that is longthan a height measure of the fitting portion 29 from the plane portion 5is formed. On a bottom face 10 of the concavity 9, the electroniccomponent 4 is mounted by soldering, so that it is electricallyconnected to a conductive pattern 3 a. In addition, in the concavity 9,a plurality of through holes 12 is formed for penetrating from thebottom face 10 of the concavity 9 to a back face portion 11 of the basemember 2. A pair of groove portions 13 is formed on the back faceportion 11 along longitudinal direction of the base member 2.

Terminals 16, which are to be soldered to a wiring pattern 15 of amother board 14 when the base member 2 is fixed on the mother board 14,are formed with a conductive pattern 3 on both end portions in widthdirection of the back face portion 11 of the base member 2. Furthermore,contacts 8, which are to be electrically connected to contact terminalportions 7 of the socket 6 as the counterpart connector, are integrallyformed with the conductive pattern 3 along outer side faces of thefitting portion 29.

Each terminal 16 has a parallel face 16 c parallel to the wiring pattern15 of the mother board 14 at a center portion thereof, and an outerinclined face (including perpendicularity) 16 a and an inner inclinedface 16 b at both end portion thereof which are not parallel to thewiring pattern 15 of the mother board 14. Fillets of solder are formedon the inclined faces 16 a and 16 b, so that the terminal 16 iselectrically connected to the wiring pattern 15 of the mother board 14.A conductive pattern 3 b is formed along an inner peripheral surface ofeach through hole 12, so that the conductive pattern 3 a on the bottomface 10 of the concavity 9 and the conductive pattern 3 c on the backface portion 11 are electrically connected, and the contacts 8 and theterminals 16 are electrically connected through electronic component 4.

Subsequently, manufacturing process of the base member 2 is describedwith reference to FIG. 3 and FIG. 4. FIG. 3 is a flowchart showing themanufacturing process of the base member 2, and FIG. 4 is a sectionalview showing a configuration of the base member 2 just beforeimplementation.

At first, a base substance of three-dimensional formation circuit boardis molded (S1). Subsequently, a Cu film is formed by sputteringtechnique to cover the entire surface of the base substance (S2), and aCu film is patterned by using a laser beam (S3). Furthermore,electrolytic plating of Cu is performed on only a part which it isnecessary (S4), and Cu of unnecessary portion is removed by etching(S5). After that, electrolytic plating of Ni is performed to the basesubstance (S6), and electrolytic plating of Au is performed thereto(S7). Finally, as shown in FIG. 4, the base member 2 and the feedingside 18 of plating current are cut off in disconnecting portion 17 onthe plane portion 5 (S8). The base member 2 comprised of thethree-dimensional formation circuit board on which conductive pattern 3is formed is finished.

Since the base member 2 of three-dimensional formation circuit board ismanufactured by the above-mentioned processes, the contacts 8 and theterminals 16 are integrally formed with the conductive pattern 3 on thebase member 2. Therefore, the contacts 8, the terminals 16 and theconductive pattern 3 can easily be modified depending on purpose.Furthermore, since a superficial area of the base member 2 of thethree-dimensional formation circuit board is relatively larger,complicated electric wiring can be formed, and a lot of electroniccomponents 4 can be mounted on the base member 2. As a result, degreesof freedom of design can be increased. Still furthermore, since theelectronic component 4 is disposed on the bottom face 10 of theconcavity 9 of base member 2, namely, on a plane portion, reflowsoldering can be used for soldering of the electronic component 4,mounting workability of the electronic component 4 is improved, andyield of manufacture can be increased.

Subsequently, a configuration of a modification of the connector inaccordance with the first embodiment is shown in FIG. 5. As shown inFIG. 5, it is possible that a sealant 19 is filled in the cavity 9 so asto cover and seal the electronic component 4. With respect to the otherstructure, it is similar to the above-mentioned case, so that thedescription of it is omitted. In this way, even though a number of stepsof the manufacturing processes is increased and it causes the increaseof the cost a little by covering and sealing the electronic component 4,it is possible to protect the electronic component 4 further to theabove-mentioned effects. The same goes for in the following embodiments.

Subsequently, a connector with an electronic component built-in inaccordance with a second embodiment of the present invention isdescribed in detail with reference to figures. FIG. 6 is a sectionalview showing a configuration of a header of a connector in accordancewith the second embodiment.

As shown in FIG. 6, holding apertures 20 each for holding a contactterminal 21 of metal are formed penetrating through the pale portion 5and the groove portions 13 of the base member 2 and along outer sidefaces of the fitting portion 29, in the second embodiment. Conductivepatterns 3 d are formed on inner peripheral surfaces of the holdingapertures 20. The contact terminal 21 has a substantially L-shapedsection, and a longitudinal side portion 21 a serves as a contact 8, anda transversal side portion 21 b serves as a terminal 16.

The contact terminal 21 is press fitted into the holding aperture 20 ina manner so that the longitudinal side portion 21 a is directed upwardfrom the back face side of the base member 2 under a condition that afront end of the transversal side portion 21 b is directed outward. Inother words, the direction of press fitting of the contact terminal 21to the holding aperture 20 of the base member 2 is set to beperpendicular to the direction of press contact of the contact terminalportion 7 of the socket 6 as the counter part connector (see FIG. 7). Inaddition, a portion among the longitudinal side portion 21 a pressfitted into the holding aperture 20 serves as a portion to be held.

By such a configuration, the longitudinal side portion 21 a of thecontact terminal 21 serving as a contact 8 goes along an outer side faceof the fitting portion 29, and a lower end of the longitudinal sideportion 21 b is electrically connected to the conductive pattern 3 dformed on an inner peripheral surface of the holding aperture 20.Similarly, owing to the transversal side portion 21 b of the contactterminal 21 serving as a terminal 16 is contacted on the back face ofthe base member 2, the contact terminal 21 is fixed on the base member2, and the transversal side portion 21 b is electrically connected tothe conductive pattern 3 e formed in neighborhood of an edge in widthdirection on the back face portion 11 of the base member 2.

In the constitutional example shown in FIG. 6, the electric connectionof the contact terminal 21 with the conductive pattern 3 and themechanical connection of the contact terminal 21 and the base member 2are performed by merely press fitting the longitudinal side portion 21 aof the contact terminal 21 into the holding aperture 20. In other words,since the contact terminal 21 and the conductive pattern 3 are not fixedby soldering, it is possible to prevent the flaking of the conductivepattern 3 from the base member 2 due to pressure received from thecontact terminal portion 7 of the socket 6. Furthermore, since thecontact terminal 21 having a substantially L-shaped section is used as acontact 8 for electrically connecting the contact terminal portion 7 ofthe socket as the counterpart connector with the base member 2,durability of the contact body 8 is increased.

Subsequently, a configuration of a modification of the connector inaccordance with the second embodiment is shown in FIG. 7. As shown inFIG. 7, it is possible that the contact terminal 21 and the conductivepattern 3 are soldered in the groove portion 13 (soldered portion isdesignated by a numeric symbol 22) for electrically connecting andmechanically fixing the contact terminal 21 with the conductive pattern3.

According to this modification, the contact terminal 21 and theconductive pattern 3 are fixed by soldering. However, the direction ofpress fitting of the contact terminal 21 into the holding aperture 20 ofthe base member 2 is set to be perpendicular to the direction ofpressure received from the contact terminal portion 7 of the socket 6,so that it is possible to reduce the load due to the contact pressure tothe soldered portion 22 of the contact terminal 21 and the conductivepattern 3, and it is possible to prevent the flaking of the conductivepattern 3 from the base member 2 due to the load.

In addition, it is possible to use conductive paste for electricallyconnecting the contact terminal 21 and the conductive pattern 3.Furthermore, it is possible to fill the sealant 19 into the cavity 9 sothat the electronic component 4 is covered and sealed by the sealant 19.

Subsequently, a connector with an electronic component built-in inaccordance with a third embodiment of the present invention is describedin detail with reference to the figures. FIG. 8 is a sectional viewshowing a configuration of a header in of a connector in accordance withthe third embodiment.

As shown in FIG. 8, press fitting apertures 23 each for holding a longerlongitudinal side portion 27 a of a contact terminal 27 made of a metalare formed on the plane portion 5 of the base member 2 along outer sidefaces of the fitting portion 29, in the third embodiment. Furthermore,holding apertures 25 each for folding a shorter longitudinal sideportion 27 b of the contact terminal 27 are formed on upper faces 24 ofthe fitting portions 29 in directions perpendicular to a direction ofcontacting with the socket 6 as the counterpart connector. An open end26 of the holding aperture 25 is formed so that a width of the open end26 becomes gradually wider toward outside. Still furthermore, aconductive pattern 3 f is formed on an inner peripheral surface of theholding aperture 25.

The contact terminal 27 is a metal band formed substantially U-shapehaving the longer longitudinal side portion 27 a, the shorterlongitudinal side portion 27 b and a transversal side portion 27 c, andthe longer longitudinal side portion 27 a serves as a contact 8. Thecontact terminal 27 is held on the base member 2 in a manner so that thelonger longitudinal side portion 27 a is press fitted into the pressfitting aperture 23 and the shorter longitudinal side portion 27 b ispress fitted into the holding aperture 25 from above the base member 2.A neighboring portion of a free end of the longer longitudinal sideportion 27 a and a neighboring portion of a free end of the shorterlongitudinal side portion 27 b respectively serve as portions to be heldwhich are press fitted into the press fitting aperture 23 and theholding aperture 25.

When the contact terminal 27 is held on the base member 2, the shorterlongitudinal side portion 27 b is connected to the conductive pattern 3f formed on the inner peripheral surface of the holding aperture 25, andthe transversal side portion 27 c is contacted with a conductive pattern3 g formed on the upper face 24 of the fitting portion 29 of the basemember 2. Furthermore, the contact terminal 27 and the conductivepattern 3 are soldered (soldered portion is designated by a numericsymbol 28) for electrically connecting and mechanically fixing thecontact terminal 27 with the conductive pattern 3. As a result, thelonger longitudinal side portion 27 a of the contact terminal 27 alongan outer side face of the fitting portion 29 of the base member 2 servesas a contact 8.

Besides, it is not necessarily soldered for electrically connecting andmechanically fixing the contact terminal 27 and the conductive pattern3, but it is possible that the contact terminal 27 is simply pressfitted into the holding aperture 25. Alternatively, a conductive pastecan be used in substitution for soldering. Furthermore, it is possibleto fill the sealant 19 into the cavity 9 so that the electroniccomponent 4 is covered and sealed by the sealant 19.

According to the third embodiment, since the contact terminal 27 is usedas a contact 8 which is electrically connected to the contact terminalportion 7 of the socket 6 which is a counterpart connector, durabilityof the contact 8 is increased. Furthermore, since the direction forpress fitting the contact terminal 27 into the base member 2 is to beperpendicular to the direction of the contact pressure received from thesocket 6, it is possible to reduce the load to the soldered portion 28of the contact terminal 27 and the conductive pattern 3 due to thecontact pressure, and it is possible to prevent the flaking of theconductive pattern 3 from the base member 2 due to the load.

In addition, the present invention is not limited to the connector usedfor the mother board as mentioned in each above embodiment. For example,it can be used for a connector connected to an interface cable providedon a mobile phone or a PDA (Personal Digital Assistant).

Furthermore, the connector with an electronic component built-in is notlimited to the header constituting the connector as mentioned in eachabove embodiment. For example, the electronic component may be built-inan interior of the socket which is a counterpart connector of theheader.

The present application is based on Japan patent Application No.2003-301913, the contents of which are hereby incorporated byreferences.

Although the present invention has been fully described by way ofexample with reference to the accompanying drawings, it is to beunderstood that various changes and modifications will be apparent tothose skilled in the art. Therefore, unless otherwise such changes andmodifications depart from the scope of the present invention, theyshould be construed as being included therein.

1. A connector with an electronic component built-in comprising: a basemember formed of a three-dimensional formation circuit board; terminalsformed on said base member and electrically connected to wiring patternof a mother board; a fitting portion formed on said base member, and tobe fitted to a counterpart connector; contacts arranged on said fittingportion and to be electrically connected with contacting terminalportions of said counterpart connector; an electric component disposedon said base member; and a conductive pattern formed on said base memberfor electrically connecting said terminals or said contacts with saidelectronic component.
 2. The connector in accordance with claim 1,wherein said contact is integrally formed with conductive pattern formedon said base member.
 3. The connector in accordance with claim 1,wherein said contact is constituted by a contact terminal made of ametal and disposed on said fitting portion of said base member.
 4. Theconnector in accordance with claim 3, wherein holding apertures each forholding said contact terminal are formed on said base member in adirection perpendicular to a direction of press contact of contactterminals of a counterpart connector; said contact terminal has aportion serving as a contact disposed along an outer side face of saidfitting portion, and a portion to be held which is extended from saidportion serving as a contact and is press fitted into and held by saidholding aperture; and said conductive pattern connected to the portionto be held of said contact terminal which is press fitted into and heldon said holding aperture is formed on an inner peripheral surface ofsaid holding aperture.
 5. The connector in accordance with claim 1,wherein said terminal is integrally formed with a conductive patternformed on said base member.
 6. The connector in accordance with claim 5,wherein said conductive pattern is formed across a fixing face of saidbase member to be fixed on said mother board and a plane which is not inparallel with said fixing face of said base member.
 7. The connector inaccordance with claim 1, wherein said base member has a cavity in whichsaid electronic component is mounted.
 8. The connector in accordancewith claim 7, wherein a sealant is filled in said cavity.